Infusing AI/ML into Chip Design on Hybrid Clouds for Future SoC Development
- Gi-Joon Nam
- 2024
- EPS 2024
Invited talk
Publications
68 results for Chiplets
AI chiplets in an open ecosystem: barriers and solution approaches
- Daniel Friedman
- 2024
- DAC 2024
Workshop paperA Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Workshop paperElectromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
Conference paperEffect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- 2024
- ITherm 2024
Conference paperReduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- Pritish Parida
- Shurong Tian
- et al.
- 2024
- ITherm 2024
Conference paperUltra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
Conference paperA Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Conference paperSystems Two-Phase Cooling
- Pritish Parida
- Timothy Chainer
- et al.
- 2024
- ARPA-E Summit 2024
PosterReliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024
Conference paper