Simulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert

Power insert, which is originally proposed by IBM Research-Zurich in 2014, is laminated copper sheets with dielectric and it is placed in the center region of an organic substrate. It works for power delivery and simultaneously, for thermal conduction. In this paper, thermal performance of power insert is simulated and its effect to decrease the chip average temperature and the chip hot spot temperature is analyzed. Also electrical performance, such as IR drop from BGA to power insert, is simulated. Additionally, thermo-mechanical performance is simulated and it is compared with typical flip chip package.