Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paper
Publications
68 results for Chiplets
Advanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- Yigit Turan
- Xinchen Wang
- et al.
- 2026
- ECTC 2026
PosterLithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- Chris Bottoms
- Sarah Nahar Chowdhury
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperEnabling Enterprise AI with IBM Spyre
- Jeffrey Burns
- Leland Chang
- et al.
- 2025
- IEDM 2025
Invited talkEffective Media Approximation in Investigating Heat Transfer through Multiple Sandwiched Layers of BEOL Materials
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- SHTC 2025
Conference paperInnovative BEOL Oxide-Based Devices as Key Enablers for High-Performing Heterogeneous Systems
- 2025
- DRC 2025
Invited talkA Near-DRAM Accelerator for Compiler-Generated Fully Homomorphic Encryption Applications
- 2025
- ISCA 2025
Workshop paperIBM’s SARA SoC/SiP Project: Application-Driven High Level View
- Pradip Bose
- 2025
- ISCA 2025
Workshop paperChiplet and Heterogeneous integration Technologies for HPC and AI
- 2025
- VLSI Technology and Circuits 2025
Workshop paperArchitectural Benchmarking of Compute-in-Memory Systems
- Pritish Narayanan
- Sidney Tsai
- 2025
- VLSI Technology and Circuits 2025
Workshop
