Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution

Direct Bridge Multi-die (DBrM) packaging is a novel silicon bridge packaging technology enabled by a chip reconstitution technology utilizing a simple yet innovative die-edge gluing technique. DBrM offers superior reliability, modularity, and scalability, making it suitable for applications ranging from edge devices to high-end systems, including TSV bridge integration.