Advanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging

Abstract—Flip-chip packages exhibit complex warpage behavior due to heterogeneous and anisotropic material interactions under thermal cycling. This paper presents an acoustic-emission (AE) sensor -based monitoring approach for real-time warpage inference . Controlled excitations are introduced using piezoelectric transducers, while surface -mounted AE sensors capture structural responses associated with deformation. Experimental results demonstrate that the proposed method enables sensitive, non-destructive, and in-situ monitoring of warpage evolution, complement ing conventional modeling and offline inspection techniques.