Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
We introduce a planar, triple-self-aligned double-gate FET structure ("PAGODA"). Device fabrication incorporates wafer bonding, front-end CMP, mixed optical/ebeam lithography, silicided silicon source/drain sidewalls, and back gate undercut and passivation. We demonstrate double-gate FET operation with good transport at both interfaces, inverter action, and NOR logic.
Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
O.F. Schirmer, K.W. Blazey, et al.
Physical Review B
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997