Publications

8 results for K. Petrarca

Copper through silicon via (TSV) for 3D integration
- - C. Kothandaraman
  - B. Himmel
  - et al.
- 2012
- IRPS 2012
3D copper TSV integration, testing and reliability
- - Mukta Farooq
  - T. Graves-Abe
  - et al.
- 2011
- IEDM 2011
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- - Matthew Angyal
  - Jason Gill
  - et al.
- 2005
- AMC 2005
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- - T. Dalton
  - N. Fuller
  - et al.
- 2004
- IITC 2004
Two gates are better than one
- - P. Solomon
  - K.W. Guarini
  - et al.
- 2003
- IEEE Circuits and Devices Magazine
Characteristics and device design of sub-100 nm strained Si N- and PMOSFETs
- - K. Rim
  - J.O. Chu
  - et al.
- 2002
- VLSI Technology 2002
Triple-self-aligned, planar double-gate MOSFETs: Devices and circuits
- - K.W. Guarini
  - P. Solomon
  - et al.
- 2001
- Technical Digest-International Electron Devices Meeting