Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Advanced Packaging
Presented here are results and recommendations for reducing coupling between adjacent power islands based on full-wave simulations of a HyperBGA SCM (single-chip module). These simulations highlight the use of IBM's internally developed accelerated full-wave solver based on the precorrected fast Fourier transform approach. Speedups of 100 × and memory reductions of 12 × are shown for real engineering problems, as compared to direct integral equation solutions. © 2007 IEEE.
Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Advanced Packaging
I.M. Elfadel, Alina Deutsch, et al.
IEEE Transactions on Advanced Packaging
Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
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IEEE T-MTT