Publications

92 results for Alina Deutsch

Analysis and optimization of low-power passive equalizers for cpu-memory links
- - Ling Zhang
  - Wenjian Yu
  - et al.
- 2011
- IEEE Transactions on CPMT
Prediction and comparison of high-performance on-chip global interconnection
- - Yulei Zhang
  - Xiang Hu
  - et al.
- 2011
- IEEE Transactions on VLSI Systems
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- - Lijun Jiang
  - Chuan Xu
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- - Lijun Jiang
  - Chuan Xu
  - et al.
- 2010
- APEMC 2010
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- - Alina Deutsch
  - Roger S. Krabbenhoft
  - et al.
- 2010
- IEEE Trans Electromagn Compat
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- - Jianyong Xie
  - Daehyun Chung
  - et al.
- 2009
- EPEPS 2009
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- - Jianyong Xie
  - Daehyun Chung
  - et al.
- 2009
- 3DIC 2009
The effects of time windowing on the accuracy of the short-pulse propagation technique
- - Lionelle F. Wells
  - Alina Deutsch
  - et al.
- 2009
- EPEPS 2009
Prediction of high-performance on-chip global interconnection
- - Yulei Zhang
  - Xiang Hu
  - et al.
- 2009
- SLIP 2009
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- - Chuan Xu
  - Lijun Jiang
  - et al.
- 2009
- ICCAD 2009