Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat
Publications
36 results for Christopher W. Surovic
Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
- A. Deutsch
- Roger Krabbenhoft
- et al.
- 2008
- SPI 2008
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
Prediction of losses caused by roughness of metallization in printed-circuit boards
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
Losses caused by roughness of metallization in printed-circuit boards
- A. Deutsch
- C. Surovic
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Superior electrical properties of High Performance Glass Ceramic packaging for demanding SiGe, ASIC, microprocessor and advanced server applications
- Warren D. Dyckman
- Benjamin Fasano
- et al.
- 2005
- DPC 2005
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
- J.D. Morsey
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005