A rigorous approach for the radiated emission characterization based on the spherical magnetic field scanning
- Ping Li
- Li Jun Jiang
- 2014
- IEEE Trans Electromagn Compat
Paper
Publications
24 results for Li Jun Jiang
Finite-element-based generalized impedance boundary condition for modeling plasmonic nanostructures
- Shiquan He
- Wei E.I. Sha
- et al.
- 2012
- IEEE TNANO
PaperA thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
PaperTime-domain field responses of the thin, high-contrast, finely layered structure in IC packagings
- Adrianus T. De Hoop
- Lijun Jiang
- 2010
- EPEPS 2010
Conference paperElectrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010
Conference paperOn the dual basis for solving electromagnetic surface integral equations
- Mei Song Tong
- Weng Cho Chew
- et al.
- 2009
- IEEE Trans Antennas Propag
PaperEffect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Conference paperElectrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
Conference paperFast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009
Conference paperInterconnect performance and scaling strategy for the 22 nm node and beyond
- James H.-C. Chen
- Lijun Jiang
- et al.
- 2008
- ADMETA 2008
Conference paper