Publications

32 results at IEEE Transactions on Advanced Packaging

Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- - Ki Jin Han
  - Madhavan Swaminathan
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
Waveform relaxation time domain solver for subsystem arrays
- - Giulio Antonini
  - Albert E. Ruehli
- 2010
- IEEE Transactions on Advanced Packaging
Random rough surface effects on wave propagation in interconnects
- - Leung Tsang
  - Henning Braunisch
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- - Lijun Jiang
  - Chuan Xu
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
Integrated microfluidic cooling and interconnects for 2D and 3D chips
- - Bing Dang
  - Muhannad S. Bakir
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2009
- IEEE Transactions on Advanced Packaging
Is 25 Gb/s on-board signaling viable?
- - Dong G. Kam
  - Mark B. Ritter
  - et al.
- 2009
- IEEE Transactions on Advanced Packaging
PEEC modeling of dispersive and lossy dielectrics
- - Giulio Antonini
  - Albert E. Ruehli
  - et al.
- 2008
- IEEE Transactions on Advanced Packaging
Polymer-waveguide-based board-level optical interconnect technology for datacom applications
- - Roger Dangel
  - Christoph Berger
  - et al.
- 2008
- IEEE Transactions on Advanced Packaging
A packaging solution for optically testing wire-bonded chips
- - Alberto Tosi
  - Franco Stellari
  - et al.
- 2008
- IEEE Transactions on Advanced Packaging