A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Paper
Publications
32 results at IEEE Transactions on Advanced Packaging
Waveform relaxation time domain solver for subsystem arrays
- Giulio Antonini
- Albert E. Ruehli
- 2010
- IEEE Transactions on Advanced Packaging
PaperRandom rough surface effects on wave propagation in interconnects
- Leung Tsang
- Henning Braunisch
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
PaperElectromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- Ki Jin Han
- Madhavan Swaminathan
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
PaperIntegrated microfluidic cooling and interconnects for 2D and 3D chips
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Paper160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
PaperIs 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
PaperPEEC modeling of dispersive and lossy dielectrics
- Giulio Antonini
- Albert E. Ruehli
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
PaperPolymer-waveguide-based board-level optical interconnect technology for datacom applications
- Roger Dangel
- Christoph Berger
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
PaperA packaging solution for optically testing wire-bonded chips
- Alberto Tosi
- Franco Stellari
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
Paper