H.D. Dulman, R.H. Pantell, et al.
Physical Review B
Patterning of 100 nm critical dimension features using X-ray proximity lithography is discussed. Lithographic performance is shown using photoresists APEX-E, UV-4 and an experimental formulation of ESCAP photoresist. Conditions to pattern isolated and nested lines at maximum permissible gap is discussed. ©1997TAPJ.
H.D. Dulman, R.H. Pantell, et al.
Physical Review B
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Microelectronic Engineering
Robert W. Keyes
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Advanced Materials