Conference paperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectricsF. Chen, J. Gill, et al.IRPS 2004
PaperRapid programmable 300 ps optical delay scanner and signal-averaging system for ultrafast measurementsD. Edelstein, R.B. Romney, et al.Review of Scientific Instruments
Conference paperIn-situ metal/dielectric capping process for electromigration enhancement in Cu interconnectsChih-Chao Yang, Fen Chen, et al.IITC 2012
Conference paperElectromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentalsTakeshi Nogami, C. Penny, et al.IEDM 2012
