Publications

23 results for T. Dalton

Plasma ash processing solutions for advanced interconnect technology
- - N. Fuller
  - M.A. Worsley
  - et al.
- 2008
- Thin Solid Films
Effect of radical species density and ion bombardment during ashing of extreme ultralow- κ interlevel dielectric materials
- - M.A. Worsley
  - S. Bent
  - et al.
- 2007
- Journal of Applied Physics
Silicon-on-insulator MOSFETs with hybrid crystal orientations
- - M. Yang
  - K.K. Chan
  - et al.
- 2006
- VLSI Technology 2006
Non-poisoning dual damascene patterning scheme for low-k and ultra low-k BEOL
- - W. Cote
  - D. Edelstein
  - et al.
- 2006
- ADMETA 2006
Analysis of plasma-induced modification of ULK and eULK Materials: Dual damascene processing challenges for 45nm (κ ≤ 2.4) and beyond BEOL technologies
- - N. Fuller
  - M.A. Worsley
  - et al.
- 2006
- IITC 2006
Characterization of neutral species densities in dual frequency capacitively coupled photoresist ash plasmas by optical emission actinometry
- - M.A. Worsley
  - S. Bent
  - et al.
- 2006
- Journal of Applied Physics
Extendibility of PVD barrier/seed for BEOL Cu metallization
- - C.-C. Yang
  - D. Edelstein
  - et al.
- 2005
- IITC 2005
Plasma induced dielectric modification: Etching challenges for 65nm and beyond technology nodes
- - N. Fuller
  - M.A. Worsley
  - et al.
- 2005
- ISTC 2005
Effect of plasma interactions with low-κ films as a function of porosity, plasma chemistry, and temperature
- - Marcus A. Worsley
  - Stacey F. Bent
  - et al.
- 2005
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Aggressively scaled (0.143 μm ²) 6T-SRAM cell for the 32 nm node and beyond
- - D. Fried
  - J. Hergenrother
  - et al.
- 2004
- IEDM 2004