Conference paper
On the dynamic resistance and reliability of phase change memory
B. Rajendran, M.H. Lee, et al.
VLSI Technology 2008
At the 22 nm node, we estimate that superior electrostatics and reduced junction capacitance in FinFETs may provide a 13∼23% reduction in delay relative to planar FETs. However, this benefit is offset by enhanced gate-to-source/drain capacitance (Cgs) in FinFETs. Here, we measure FinFET Cgs capacitance at 22nm-like dimensions and determine that, with optimization, the FinFET capacitance penalty can be limited to <6%, resulting in an overall advantage of up to 17% over a planar technology. © 2008 IEEE.
B. Rajendran, M.H. Lee, et al.
VLSI Technology 2008
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IEDM 2023
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