Single-step deep reactive ion etch of silicon for through-via applications with alternative gas mixtures
- Richa Agrawal
- Nathan Marchack
- et al.
- 2025
- Journal of Vacuum Science and Technology A Vacuum Surfaces and Films
Publications
10 results for Bang To
Sub-30 nm pitch line-space patterning of semiconductor and dielectric materials using directed self-assembly
- Hsin-Yu Tsai
- Hiroyuki Miyazoe
- et al.
- 2012
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
A 0.021 μm2 trigate SRAM cell with aggressively scaled gate and contact pitch
- Michael A. Guillorn
- Josephine Chang
- et al.
- 2011
- VLSI Technology 2011
Hydrogen silsesquioxane-based hybrid electron beam and optical lithography for high density circuit prototyping
- M. Guillorn
- J. Chang
- et al.
- 2009
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Trigate 6T SRAM scaling to 0.06 μm2
- M. Guillorn
- J. Chang
- et al.
- 2009
- IEDM 2009
Plasma etching of nanometer-scale self-assembled features
- Ying Zhang
- Charles T. Black
- et al.
- 2008
- ISTC 2008
FinFET performance advantage at 22nm: An AC perspective
- M. Guillorn
- J. Chang
- et al.
- 2008
- VLSI Technology 2008
Investigation of FinFET devices for 32nm technologies and beyond
- H. Shang
- L. Chang
- et al.
- 2006
- VLSI Technology 2006
High Performance CMOS Fabricated on Hybrid Substrate with Different Crystal Orientations
- M. Yang
- M. Ieong
- et al.
- 2003
- IEDM 2003
Fabrication and Mobility Characteristics of Ultra-thin Strained Si Directly on Insulator (SSDOI) MOSFETs
- K. Rim
- K.K. Chan
- et al.
- 2003
- IEDM 2003