Conference paper
Measurement of microbump thermal resistance in 3D chip stacks
E.G. Colgan, Paul Andry, et al.
SEMI-THERM 2012
A novel reduced mask process is used to fabricate high-resolution high-aperture-ratio 10.5-in. SXCA (1280 × 1024) displays. The process uses copper gate-metallurgy with redundancy, without the need for extra processing steps. The resulting displays have 150-dpi color resolution, an aperture ratio of over 35%, and excellent image quality, making them the first high-resolution displays that are suitable for notebook applications.
E.G. Colgan, Paul Andry, et al.
SEMI-THERM 2012
J.M.E. Harper, K.P. Rodbell, et al.
Journal of Applied Physics
P.M. Fryer, E.G. Colgan, et al.
MRS Spring Meeting 1998
S.C. Lien, C. Cai, et al.
Japanese Journal of Applied Physics, Part 2: Letters