Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Conference paper
Publications
43 results for Robert Polastre
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperLocal measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Conference paperEmbedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Conference paperAdvanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Conference paperTransferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
Conference paperMeasurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Conference paperMicro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
Conference paper2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Conference paperMeasurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Conference paper