Dario Goldfarb

Title

Research Staff Member
Dario Goldfarb

Publications

  • IBM Lithography Roadmap and Need for Future Lithography Tools

      • Allen Gabor
      • Martin Burkhardt
      • et al.
    • 2025
    • EUVL and Source Workshop 2025
  • Dry heterometallic resist processing based on thermal sublimation deposition and development

      • Dario Goldfarb
      • Scott Lewis
      • et al.
    • 2022
    • JM3
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Patents

    • 01 Jan 2014
    • GB
    • 2310910

    Ultra Low Post Exposure Bake Photoresist Materials

    • 01 Jan 2014
    • EP
    • 2310910

    Ultra Low Post Exposure Bake Photoresist Materials

    • 01 Jan 2014
    • FR
    • 2310910

    Ultra Low Post Exposure Bake Photoresist Materials

    • 01 Jan 2014
    • DE
    • 602010012809.1

    Ultra Low Post Exposure Bake Photoresist Materials

    • 03 Dec 2013
    • US
    • 8598018

    Forming An Electrode Having Reduced Corrosion And Water Decomposition On Surface Using A Custom Oxide Layer

    • 04 Oct 2013
    • JP
    • 5379346

    Method For Multilevel Multiexposure Dual Damascene Structures

    • 17 Sep 2013
    • US
    • 8536031

    Method Of Fabricating Dual Damascene Structures Using A Multilevel Multiple Exposure Patterning Scheme

    • 14 May 2013
    • CN
    • ZL201080007232.X

    Ultra Low Post Exposure Bake Photoresist Materials

    • 06 May 2013
    • US
    • 8435719

    Tunable Contact Angle Process For Immersion Lithography Topcoats And Photoresists

    • 12 Mar 2013
    • US
    • 8395228

    Novel Integration Process To Improve Focus Leveling Within A Lot Process Variation

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Top collaborators

LM
Luciana Meli

Luciana Meli

Senior Manager: Patterning & Metrology
JR
Jed Rankin

Jed Rankin

Photomask Supply and Development Strategy
AG
Allen Gabor

Allen Gabor

Distinguished Engineer
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Work location

IBM Research - Yorktown HeightsYorktown Heights, NY USA

Contact

More publications

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