Publications

2 results at ECTC 2026

Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- - Mohammed Alhendi
  - Luke Darling
  - et al.
- 2026
- ECTC 2026
Advanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- - Yigit Turan
  - Xinchen Wang
  - et al.
- 2026
- ECTC 2026