Understanding high numerical aperture optical lithography
- D. Flagello
- Alan E. Rosenbluth
- et al.
- 1992
- Microelectronic Engineering
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Positive mode silylation process characterization
- D.C. La Tulipe
- A.T.S. Pomerene
- et al.
- 1992
- Microelectronic Engineering
Shallow junctions, silicide requirements and process technologies for sub 0.5 μm CMOS. Invited review paper
- Bijan Davari
- 1992
- Microelectronic Engineering
Overlay measurement using the low voltage scanning electron microscope
- Michael G. Rosenfield
- A. Starikov
- 1992
- Microelectronic Engineering
SiCGe ternary alloys - extending Si-based heterostructures
- Subramanian S. Iyer
- K. Eberl
- et al.
- 1992
- Microelectronic Engineering
Definition and measurement rule for voltage resolution of contactless testing systems based on electron-beam or photoemission methods
- R. Clauberg
- R. Lackmann
- 1992
- Microelectronic Engineering
Annealing behavior of gold absorber in x-ray masks
- R.E. Acosta
- W.A. Johnson
- et al.
- 1992
- Microelectronic Engineering
Light scattering properties of x-ray lithography mask substrates
- J.R. Maldonado
- Y. Vladimirsky
- et al.
- 1991
- Microelectronic Engineering
Comparison of vapor and liquid phase silylation processes of photoresists
- E. Babich
- J. Paraszczak
- et al.
- 1991
- Microelectronic Engineering
Device design issues for a high-performance technology with Si or SiGe epitaxial base
- J.N. Burghartz
- J.D. Cressler
- et al.
- 1991
- Microelectronic Engineering