Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density
- Yang Wang
- David W. Collinson
- et al.
- 2023
- Small
Paper
Publications
17 results for Kenneth E. Goodson
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Conference paperValidation study for VOF simulations of boiling in a microchannel
- Catherine Gorle
- Hyoungsoon Lee
- et al.
- 2015
- InterPACK 2015
Conference paperPhonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals
- Jaeho Lee
- Elah Bozorg-Grayeli
- et al.
- 2013
- Applied Physics Letters
PaperThermoelectric characterization and power generation using a silicon-on-insulator substrate
- Jaeho Lee
- Sangbum Kim
- et al.
- 2012
- JMEMS
PaperMicrothermal stage for electrothermal characterization of phase-change memory
- Jaeho Lee
- Sangbum Kim
- et al.
- 2011
- IEEE Electron Device Letters
PaperResistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage
- Sangbum Kim
- Byoungil Lee
- et al.
- 2011
- IEEE T-ED
PaperA benchmark study on the thermal conductivity of nanofluids
- Jacopo Buongiorno
- David C. Venerus
- et al.
- 2009
- Journal of Applied Physics
PaperDesign of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation
- William P. King
- Thomas W. Kenny
- et al.
- 2002
- JMEMS
PaperThermal conductivity model for thin silicon-on-insulator layers at high temperatures
- Mehdi Asheghi
- Bahareh Behkam
- et al.
- 2002
- IEEE International SOI Conference 2002
Conference paper