Publications

24 results for Akihiro Horibe

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- - Akihiro Horibe
  - Chinami Marushima
  - et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022
Vertical interconnect technology for enlarging capacity on micro solid thin film rechargeable battery
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2019
- ECTC 2019
Implementation challenges for scalable neuromorphic computing
- - Shintaro Yamamichi
  - Akihiro Horibe
  - et al.
- 2017
- VLSI Circuits 2017
Implementation challenges for scalable neuromorphic computing
- - Shintaro Yamamichi
  - Akihiro Horibe
  - et al.
- 2017
- VLSI Technology 2017
Solder Injected through Via for Multi Stacked Wafers
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2016
- ECTC 2016
Full intermetallic joints for chip stacking by using thermal gradient bonding
- - T.L. Yang
  - Toyohiro Aoki
  - et al.
- 2016
- Acta Materialia