Publications

34 results for C.-Y. Ting

Controlled Collapse Reflow for Josephson Chip Bonding
- - C.-Y. Ting
  - K.R. Grebe
  - et al.
- 2019
- JES
Electrical Properties of Al/Ti Contact Metallurgy for VLSI Application
- - C.-Y. Ting
  - B.L. Crowder
- 2019
- JES
Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- - C.-Y. Ting
  - B.L. Crowder
- 2019
- JES
Interaction Between ti and SiO₂
- - C.-Y. Ting
  - M. Wittmer
  - et al.
- 2019
- JES
High temperature process limitation on TiSi2
- - C.-Y. Ting
  - F.M. d'Heurle
  - et al.
- 2019
- JES
Ambient Gas Effects on the Reaction of Titanium with Silicon
- - Subramanian S. lyer
  - Chung-Yu Ting
  - et al.
- 2019
- JES
Thin-film topography control with transient liquid underlayer
- - Igor Y. Khandros
  - Robert J. Baseman
  - et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Gate materials consideration for submicron CMOS
- - C.-Y. Ting
  - B. Davari
- 1989
- Applied Surface Science
Source-Drain Contact Resistance in CMOS with Self-Aligned TiSi2
- - Yuan Taur
  - Jack Yuan-Chen Sun
  - et al.
- 1987
- IEEE T-ED
On the Resistivity of TiSi2: The Implication for Low-Temperature Applications
- - Lia Krusin-Elbaum
  - Jack Yuan-Chen Sun
  - et al.
- 1987
- IEEE T-ED