S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
Paper
Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
Abstract
No abstract available.
Related
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
K.N. Tu
Materials Science and Engineering: A