R. Ghez, J.S. Lew
Journal of Crystal Growth
We have investigated the interaction between Ti and SiO2in the temperature range of 400° to about 1000°C. The reaction proceeds in a layer-by-layer fashion and consists of SiO2reduction followed by the formation of a Ti-rich silicide at the interface. At higher temperatures, a Ti-rich oxide is formed near the surface. The reaction starts at approximately 400°C, and the loss of SiO2becomes significant above 500°C. A strong interaction between Ti and SiO2takes place at 700°C and above. The thicker the SiO2the higher resistance it has to degradation due to elevated temperature effects. © 1984, The Electrochemical Society, Inc. All rights reserved.
R. Ghez, J.S. Lew
Journal of Crystal Growth
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
T.N. Morgan
Semiconductor Science and Technology
Michiel Sprik
Journal of Physics Condensed Matter