Workshop paperThe evolution of barrier properties during reliability testing of Cu interconnectsM.A. Meyer, O. Aubel, et al.International Workshop on Stress-Induced Phenomena in Metallization 2008
Conference paperImpact of instrumental current scatter on fast Bias Temperature Instability testingA. Kerber, K. Zhao, et al.IIRW 2009
PaperExtensive investigations of temperature influence on barrier integrity during reliability testingO. Aubel, M.A. Meyer, et al.Microelectronic Engineering