Resistance contributions to copper interconnects
- C. Witt
- F. Baumann
- et al.
- 2017
- IITC 2017
Conference paper
Publications
21 results for C. Witt
Electromigration: Void dynamics
- C. Witt
- V. Calero
- et al.
- 2016
- IEEE T-DMR
PaperPrediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
PaperResistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Conference paperCharacterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
- Mikhail Treger
- Christian Witt
- et al.
- 2013
- Journal of Applied Physics
PaperEvolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Robert Rosenberg
- et al.
- 2013
- Journal of Applied Physics
PaperUltra low contact resistivities for CMOS beyond 10-nm node
- Zhen Zhang
- Siyuranga Obasa Koswatta
- et al.
- 2013
- IEEE Electron Device Letters
PaperUnderstanding stress gradients in microelectronic metallization
- Conal E. Murray
- E. Todd Ryan
- et al.
- 2012
- Powder Diffraction
PaperEvolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
PaperStress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters
Paper