Copper microstructure: Effect on electromigration void evolution
- C. Witt
- V. Calero
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
5 results for F. Feustel
New failure mechanism during high temperature storage testing and its application on SIV risk evaluation
- O. Aubel
- W. Yao
- et al.
- 2009
- IIRW 2009
Conference paperThe evolution of barrier properties during reliability testing of Cu interconnects
- M.A. Meyer
- O. Aubel
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Workshop paperExtensive investigations of temperature influence on barrier integrity during reliability testing
- O. Aubel
- M.A. Meyer
- et al.
- 2008
- Microelectronic Engineering
PaperA SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
Conference paper