New failure mechanism during high temperature storage testing and its application on SIV risk evaluation
- O. Aubel
- W. Yao
- et al.
- 2009
- IIRW 2009
Conference paper
Publications
3 results for M.A. Meyer
The evolution of barrier properties during reliability testing of Cu interconnects
- M.A. Meyer
- O. Aubel
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Workshop paperExtensive investigations of temperature influence on barrier integrity during reliability testing
- O. Aubel
- M.A. Meyer
- et al.
- 2008
- Microelectronic Engineering
Paper