P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The selective epitaxial growth of silicon using SiO2 as a mask is investigated in this work. The silicon films were deposited using SiCl4, H2 and HCl in an atmospheric reactor at 1050°C. The structural aspects and electrical characteristics of Schottky barrier and diffused PN diodes fabricated in silicon islands formed with the selective-epitaxial deposition technique are reported. The influence of substrate resistivity and reactive ion teching on the quality of the selective-epi is examined and found to have no effect on the electrical characteristics. Diodes fabricated inside selective-epitaxial silicon wells far from the edges of the wells have different characteristics than those that include the edges and these differences are discussed. © 1987.
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
William G. Van der Sluys, Alfred P. Sattelberger, et al.
Polyhedron
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials