Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
6 results for Sayuri Kohara
Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paperCo-packaged optics module with single mode polymer waveguide
- Akihiro Horibe
- Yoichi Taira
- et al.
- 2025
- IEDM 2025
Invited talkSimulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- MATE 2025
Conference paperReliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024
Conference paperDirect Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Short paper