Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
4 results for Risa Miyazawa
Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paperThermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2024
- ITherm 2024
Conference paperThermal Performance Characterization of Stacked Silicon Microcoolers for Spatially Non-Uniform Power Dissipation
- Aakrati Jain
- Dishit Parekh
- et al.
- 2021
- ITherm 2021
Conference paper