A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
Paper
A simple bilayer lift-off process
Abstract
This paper discusses a simplified "lift-off" process, which consists of two layers. This consists of an underlayer of soluble, thermally stable polyimide, and a new process, "silylation", which converts typical positive photoresists into oxygen RIE barriers. The uses of this new material and process for chip and packaging applications are described in this paper. © 1990.
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