Publications

11 results at ECS Meeting 2007

Enhanced cracking resistance of plasma deposited low k SiCOH films with nano imbedded layers
- - Son Nguyen
  - Eric Liniger
  - et al.
- 2007
- ECS Meeting 2007
Atomic layer deposition for CMOS scaling: High-k gate dielectrics on Si, Ge, and III-V semiconductors
- - Martin M. Frank
- 2007
- ECS Meeting 2007
Materials and process integration issues in metal gate/high-k stacks and their dependence on device performance
- - A.C. Callegari
  - K. Babich
  - et al.
- 2007
- ECS Meeting 2007
Post ion-implant photoresist removal via wet chemical cleans combined with physical force pretreatments
- - G.G. Totir
  - M.M. Frank
  - et al.
- 2007
- ECS Meeting 2007
Challenges and issues in 65nm CMOS logic technology
- - Woo-Hyeong Lee
- 2007
- ECS Meeting 2007
Process and electrical characteristics of MO-ALD HfO₂ films for high-K gate applications grown in a production-worthy 300 mm deposition system
- - R.D. Clark
  - C.S. Wajda
  - et al.
- 2007
- ECS Meeting 2007
Challenges in FEOL logic device integration for 32 nm technology node and beyond
- - Dae-Gyu Park
  - M. Chudzik
  - et al.
- 2007
- ECS Meeting 2007
Mixed orientation Si-Si interfaces by hydrophilic bonding and high temperature oxide dissolution: Wafer fabrication technique and device applications
- - K.L. Saenger
  - J.P. De Souza
  - et al.
- 2007
- ECS Meeting 2007
Recent advances in search for suitable high-k/metal gate solutions to replace SiON/Poly-silicon gate stacks in CMOS devices for 45nm and beyond technologies
- - B.P. Linder
  - V.K. Paruchuri
  - et al.
- 2007
- ECS Meeting 2007
Challenge for high-k/metal gate CMOSFETs in 32 nm generation and beyond
- - M. Takayanagi
- 2007
- ECS Meeting 2007