Fully Encapsulated Fine Pitch Dual Damascene Organic RDL with Low Dk Df Photosensitive Polyimide and Its ReliabilityMinhua LuJoyce Liuet al.2025ECTC 2025
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface MorphologySari ZereyAlina Bennett-dubinet al.2025ECTC 2025
NIMA: Near In-Memory High-Precision Accumulation Unit for Heterogeneous Analog/Digital Deep Learning AccelerationIrem SanliElena Ferroet al.2025ISCAS 2025
Live Demonstration: Automated DNN Deployment on the IBM HERMES Project ChipCorey Liam LammieJulian Büchelet al.2025ISCAS 2025
All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM DevicesDonato Francesco FalconeVictoria Clericoet al.2025Advanced Functional Materials
Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory TasksWooseok ChoiThomas Van Bodegravenet al.2025IMW 2025
Analog AI Accelerators for Transformer-based Language Models: Hardware, Workload, and Power PerformanceSidney TsaiHadjer Benmezianeet al.2025IMW 2025
MEADOW: MEMORY-EFFICIENT DATAFLOW AND DATA PACKING FOR LOW POWER EDGE LLMSAbhishek MoitraArkapravo Ghoshet al.2025MLSYS 2025
Analog-AI Hardware Accelerators for low-latency Transformer-based Language Models (Invited)Geoffrey BurrSidney Tsaiet al.2025CICC 2025
NORA: Noise-Optimized Rescaling of LLMs on Analog Compute-in-Memory AcceleratorsYayue HouSidney Tsaiet al.2025DATE 2025