StepPRM-RTL: Stepwise Process-Reward Guided LLM Fine-Tuning for Enhanced RTL Synthesis
- Prashanth Vijayaraghavan
- Apoorva Nitsure
- et al.
- 2026
- DAC 2026
Conference paper
Publications
300 results for AI Hardware
HRL-Topo: Hierarchical Reinforcement Learning with Large Language Models for Analog Circuit Topology Synthesis
- Prashanth Vijayaraghavan
- Luyao Shi
- et al.
- 2026
- DAC 2026
Conference paperDeepView: A Generalizable Debugging Methodology for Enabling Large Language Models on Emerging AI Accelerators
- Kaoutar El Maghraoui
- Jordan Murray
- et al.
- 2026
- SERVICES 2026
Conference paperEnterprise-Scale RAS in IBM Z Memory Subsystem
- Pat Meaney
- None None
- et al.
- 2026
- DSN 2026
Conference paperA 1-to-1050-mA DLDO with Rising-Edge Computational Control and Load-Dependent Feedback Achieving 46-mV/ns DVS Rate and 0.15-ps FoM
- Yichen Xu
- Mao Li
- et al.
- 2026
- VLSI Technology and Circuits 2026
Conference paperVSIMO: A DC-DC SIMO-based Current Mismatch Compensator Supporting Per-Output Bidirectional Power Flow for Stacked Voltage Domains Achieving >82% System Efficiency under up to 360-mA Load Mismatch
- Yichen Xu
- Baoqi Zhu
- et al.
- 2026
- VLSI Technology and Circuits 2026
Conference paperExploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- Sari Zerey
- Junghyun Cho
- et al.
- 2026
- ECTC 2026
Conference paperDirect Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paperHigh-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- Nimish Nazirkar
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Conference paperAdvanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- Yigit Turan
- Xinchen Wang
- et al.
- 2026
- ECTC 2026
Poster
