Toward a more robust and accurate CEM fast integral equation solver for IC applications
- Weng Cho Chew
- Li Jun Jiang
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
Review
Publications
32 results at IEEE Transactions on Advanced Packaging
Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach
- Ullrich R. Pfeiffer
- Arun Chandrasekhar
- 2005
- IEEE Transactions on Advanced Packaging
PaperExtraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
- Alina Deutsch
- Thomas-Michael Winkel
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
PaperA CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- Alina Deutsch
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
PaperA multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
- I.M. Abe Elfadel
- Alina Deutsch
- et al.
- 2004
- IEEE Transactions on Advanced Packaging
PaperTransient analysis of lossy transmission lines: An efficient approach based on the method of characteristics
- Stefano Grivet-Talocia
- Hao-Ming Huang
- et al.
- 2004
- IEEE Transactions on Advanced Packaging
PaperA comparative study of two transient analysis algorithms flor lossy transmission lines with frequency-dependent data
- Ibrahim M. Elfadel
- Hao-Ming Huang
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Conference paperPhysically consistent transmission line models for high-speed interconnects in lossy dielectrics
- Karen M. Coperich Branch
- Jason Morsey
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Conference paperSimulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package
- Lei Shan
- Mounir Meghelli
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Conference paperCharacterization and performance evaluation of differential shielded cables for multi-Gb/s data-rates
- Alina Deutsch
- Gerard V. Kopcsay
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Paper