Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
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Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
Single-chip 4 TX + 4 RX optical module based on holey SiGe transceiver IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2013
- ECTC 2013
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- Sung K. Kang
- Jaewon Chang
- et al.
- 2013
- ECTC 2013
On the impact of global information on diffusion of innovations over social networks
- Youngmi Jin
- Jungseul Ok
- et al.
- 2013
- INFOCOM 2013
Coupling task progress for MapReduce resource-aware scheduling
- Jian Tan
- Xiaoqiao Meng
- et al.
- 2013
- INFOCOM 2013
Improving ReduceTask data locality for sequential MapReduce jobs
- Jian Tan
- Shicong Meng
- et al.
- 2013
- INFOCOM 2013
Low-latency and high bandwidth TCP/IP protocol processing through an integrated HW/SW approach
- Ken Inoue
- Davide Pasetto
- et al.
- 2013
- INFOCOM 2013
Optimal bounds for online page migration with generalized migration costs
- Johannes Schneider
- Stefan Schmid
- 2013
- INFOCOM 2013