High resolution patterning of positive resist for semi-additive process
- Elizabeth A. Duch
- Minhua Lu
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Publications
64 results for Chiplets
AFM Assisted Hybrid Bonding Interface Optimization
- Nick Polomoff
- Jennifer Fullam
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Multi-reticle stitching: Applications from packaging to High-NA EUV
- Chris Bottoms
- Rick Johnson
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Simulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- MATE 2025
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
A 40 GS/s 8b-DAC SST-TX in 7 nm FinFET CMOS for cryogenic quantum applications with 32kB SRAMbased RF-DDS AWG
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
A NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
AI chiplets in an open ecosystem: barriers and solution approaches
- Daniel Friedman
- 2024
- DAC 2024
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- 2024
- ITherm 2024