Silylation of resist materials using di- and polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1990
- Microelectronic Engineering
Publications
221 results at Microelectronic Engineering
Determination of proximity effect correction parameters for 0.1 μm electron-beam lithography
- Michael G. Rosenfield
- S.J. Wind
- et al.
- 1990
- Microelectronic Engineering
A simple bilayer lift-off process
- David F. Witman
- Jane M. Shaw
- et al.
- 1990
- Microelectronic Engineering
X-ray transmission through low atomic number particles
- R.A. DellaGuardia
- David Seeger
- et al.
- 1989
- Microelectronic Engineering
Highly selective KOH-based etchant for boron-doped silicon structures
- E. Bassous
- A.C. Lamberti
- 1989
- Microelectronic Engineering
Fully scaled 0.5 μm MOS cicuits by synchroton X-ray lithography: Resist systems and line width control
- David Seeger
- K.T. Kwietniak
- et al.
- 1989
- Microelectronic Engineering
Nanolithography at 350 KV in a TEM
- A.N. Broers
- A.E. Timbs
- et al.
- 1989
- Microelectronic Engineering
A comparison of the E-beam sensitivities and relative O2-plasma stabilities of organosilicon polymers.Part III. Lithographic characteristics of poly-1,1,3-trimethyl-1-sila - and poly-1,1,3,3-tetramethyl-1,3- disilacyclobutenes and related silmethylene polymers
- E. Babich
- J. Paraszczak
- et al.
- 1989
- Microelectronic Engineering
Application of variable shaped electron beam technology to the development of 0.5 micron CMOS technology with extensions to 0.25 micron
- P. Coane
- P. Rudeck
- et al.
- 1989
- Microelectronic Engineering
Fully scaled 0.5μm MOS circuits by synchrotron radiation X-ray lithography: Mask fabrication and chraterization
- R. Viswanathan
- R.E. Acosta
- et al.
- 1989
- Microelectronic Engineering