Publications

509 results at JES

Fundamental Study of Acid Copper Through-Hole Electroplating Process
- - Edward K. Yung
  - Lubomyr T. Romankiw
- 2019
- JES
Paper
Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- - C.-Y. Ting
  - B.L. Crowder
- 2019
- JES
Paper
Electrical studies on annealed d2 plasma-exposed silicon
- - A. Henry
  - O.O. Awadelkarim
  - et al.
- 2019
- JES
Paper
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- - P.C. Andricacos
  - C. Arana
  - et al.
- 2019
- JES
Paper
Repassivation transients measured with thin film breaking electrodes
- - G.S. Frankel
  - B. Rush
  - et al.
- 2019
- JES
Paper
Equilibrium Carrier Density and Solubility of Antimony in Silicon
- - D. Nobili
  - R. Angelucci
  - et al.
- 2019
- JES
Paper
A new process using two photo-masks to prepare trilayer thin film transistors
- - Yue Kuo
- 2019
- JES
Paper
Phosphorus-Doped Polycrystalline Silicon via LPCVD: II. Surface Interactions of the Silane/Phosphine/Silicon System
- - B.S. Meyerson
  - M.L. Yu
- 2019
- JES
Paper
In Situ X-Ray Absorption Study of Chromium Valency Changes in Passive Oxides on Sputtered ALC_r Thin Films Under Electrochemical Control
- - A.J. Davenport
  - H.S. Isaacs
  - et al.
- 2019
- JES
Paper
Pd+2/poly(acrylic acid) thin films as catalysts for electroless copper deposition: Mechanism of catalyst formation
- - Robert L. Jackson
- 2019
- JES
Paper