Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John U. Knickerbocker
- Jean Benoit Herou
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
35 results for Mark D. Schultz
Photonic Modules with High Density Polymer Waveguide Interface
- J.B. Héroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Conference paperPhotonic Modules with High Density Polymer Waveguide Interface
- J.B. Heroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Conference paperCompliant Direct Attach Liquid Cooling
- Mark D. Schultz
- Pritish R. Parida
- 2024
- ITherm 2024
Conference paperAn 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
Conference paperMOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Conference paperMicroprocessor Performance with Multiple Cooling Approaches
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2022
- ITherm 2022
Conference paperHigh Performance Compliant Heat Sinks
- Mark D. Schultz
- 2022
- ITherm 2022
Conference paperSummit and Sierra supercomputer cooling solutions
- Shurong Tian
- Todd Takken
- et al.
- 2020
- IBM J. Res. Dev
PaperA single flexible coldplate cools multiple devices
- Shurong Tian
- Todd Takken
- et al.
- 2019
- ITherm 2019
Conference paper