Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Paper
Publications
6 results for Paul Ferreira
Optimizing stressor film deposition sequence in polish rate order for best planarization
- John H. Zhang
- Changyong Xiao
- et al.
- 2011
- MRS Spring Meeting 2011
Conference paperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Conference paperCu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- John H. Zhang
- Laertis Economikos
- et al.
- 2010
- MRS Online Proceedings Library
Conference paperCompetitive and cost effective high-k based 28nm CMOS technology for low power applications
- F. Arnaud
- A. Thean
- et al.
- 2009
- IEDM 2009
Conference paper32nm general purpose bulk CMOS technology for high performance applications at low voltage
- F. Arnaud
- J. Liu
- et al.
- 2008
- IEDM 2008
Conference paper