PERPENDICULAR TRANSPORT MEASUREMENTS IN GaAs/(Al,Ga)As/GaAs HETEROSTRUCTURES.
- P. Solomon
- S.L. Wright
- 1986
- IEEE T-ED
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112 results for S.L. Wright
Oxide Passivation of Photochemically Unpinned GaAs
- C.W. Wilmsen
- Alan C. Warren
- et al.
- 2019
- JES
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
- Paul S. Andry
- Cornelia K. Tsang
- et al.
- 2008
- IBM J. Res. Dev
3-D silicon integration and silicon packaging technology using silicon through-vias
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2006
- IEEE Journal of Solid-State Circuits
Viewing angle performance of medical liquid crystal displays
- Ehsan Samei
- Steven L. Wright
- 2006
- Medical Physics
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
Luminance and contrast performance of liquid crystal displays for mammographic applications
- Ehsan Samei
- Steven L. Wright
- 2004
- Technology in Cancer Research and Treatment