Publications

38 results for M.W. Lane

Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Liner materials for direct electrodeposition of Cu
- - M.W. Lane
  - C.E. Murray
  - et al.
- 2003
- Applied Physics Letters
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits
- - G. Ramanath
  - G. Cui
  - et al.
- 2003
- Applied Physics Letters
Interfacial relationships in microelectronic devices
- - Michael Lane
  - Robert Rosenberg
- 2003
- MRS Proceedings 2003
Relationship between interfacial adhesion and electromigration in Cu metallization
- - M.W. Lane
  - E. Liniger
  - et al.
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- - J.R. Lloyd
  - M.W. Lane
  - et al.
- 2002
- IIRW 2002
Invited paper environmental effects on interfacial adhesion
- - M.W. Lane
  - J.M. Snodgrass
  - et al.
- 2001
- Microelectronics Reliability
Plasticity contributions to interface adhesion in thin-film interconnect structures
- - Michael Lane
  - Reinhold H. Dauskardt
  - et al.
- 2000
- Journal of Materials Research