Publications

41 results for Philip L. Flaitz

Atomic layer deposition of sidewall spacers: Process, equipment and integration challenges in state-of-the-art logic technologies
- - Michael Belyansky
  - Richard Conti
  - et al.
- 2014
- ECS Meeting 2014
Formation of Si:CP layer through in-situ doping and implantation process for n-type metal-oxide-semiconductor devices
- - Shogo Mochizuki
  - Rainer Loesing
  - et al.
- 2014
- Thin Solid Films
CVD-Co/Cu(Mn) integration and reliability for 10 nm node
- - Takeshi Nogami
  - M. He
  - et al.
- 2013
- IITC 2013
Electrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects
- - Tibor Bolom
  - J. Lee
  - et al.
- 2013
- ADMETA 2013
Cu reflows on Ru
- - C.-C. Yang
  - Baozhen Li
  - et al.
- 2013
- ECS Solid State Letters
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
- - John H. Zhang
  - Wei-Tsu Tseng
  - et al.
- 2013
- MRS Spring Meeting 2013
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- - Takeshi Nogami
  - C. Penny
  - et al.
- 2012
- IEDM 2012
Co capping layers for Cu/low-k interconnects
- - C.-C. Yang
  - P. Flaitz
  - et al.
- 2012
- Microelectronic Engineering
Reflow of copper on ruthenium
- - C.-C. Yang
  - Y. Loquet
  - et al.
- 2011
- ADMETA 2011
Characterization of Cu reflows on Ru
- - C.-C. Yang
  - P. Flaitz
  - et al.
- 2011
- IEEE Electron Device Letters