The Role of Static Charge in Ultra-Low Alpha Particle Emissivity Measurements
- Michael. S. Gordon
- Kenneth P. Rodbell
- et al.
- 2015
- IEEE TNS
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15 results for Sri M. Sri-Jayantha
Novel mass reflow method for organic substrates
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2015
- ECTC 2015
Heat sink induced thermomechanical joint strain in QFN devices
- Gerard McVicker
- Vijay Khanna
- et al.
- 2014
- Journal of Microelectronics and Electronic Packaging
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Impact of organic substrate warp on C4 non-wets
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2011
- IEEE Transactions on CPMT
Methodology for predicting C4 non-wets during the chip attach process
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2010
- ECTC 2010
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- L. Valdevit
- V.D. Khanna
- et al.
- 2008
- Microelectronics Reliability
Thermomechanical modeling of 3D electronic packages
- Sri M. Sri-Jayantha
- Gerard McVicker
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Multirate controller for dual actuated servomechanism in hard disk drive
- A. Al-Mamun
- T. Suthasun
- et al.
- 2007
- Control and Intelligent Systems