Publications

21 results for C. Witt

Stress gradients observed in Cu thin films induced by capping layers
- - Conal E. Murray
  - Paul R. Besser
  - et al.
- 2011
- Journal of Materials Research
A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
- - Andrew Ying
  - Christian Witt
  - et al.
- 2011
- Journal of Applied Physics
Copper microstructure: Effect on electromigration void evolution
- - C. Witt
  - V. Calero
  - et al.
- 2010
- ADMETA 2010
Effect of impurity on Cu electromigration
- - C.-K. Hu
  - Matthew Angyal
  - et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
In situ evolution of stress gradients in Cu films induced by capping layers
- - Conal E. Murray
  - Paul R. Besser
  - et al.
- 2010
- Applied Physics Letters
New failure mechanism during high temperature storage testing and its application on SIV risk evaluation
- - O. Aubel
  - W. Yao
  - et al.
- 2009
- IIRW 2009
The evolution of barrier properties during reliability testing of Cu interconnects
- - M.A. Meyer
  - O. Aubel
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Stress relaxation in Cu thin films
- - C. Witt
  - R. Rosenberg
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Stress gradients observed in Cu thin films induced by capping layers
- - Conal E. Murray
  - Paul R. Besser
  - et al.
- 2009
- MRS Spring Meeting 2009
Stress gradients induced in Cu films by capping layers
- - Conal E. Murray
  - Paul R. Besser
  - et al.
- 2008
- Applied Physics Letters